
PCB Spray Painting Line
Electrostatic spraying technology
The ink is atomized into small particles and particles through the centrifugal force of an electrostatic spinning cup. The spinning cup is connected to a high-voltage negative electrode and the PCB is connected to a positive electrode, forming a high-voltage electrostatic field between the spinning cup and the workpiece. The ink particles are adsorbed onto the surface of the PCB connected to the positive electrode under the action of the electric field force and centrifugal force, forming a solder mask ink coating.
01
Third generation: Provincial ink high-speed spraying line
Working Principle
Adopting the invention and technology of "a transmission mechanism" (with license number ZL202110090989. X), a swing arm rotating linear motion mechanism is used, which is directly driven by a motor and a high rigidity reducer to move the large swing arm. The high acceleration and deceleration are increased by 10 times compared to traditional synchronous belt reciprocating machines, and the overspray amount at both ends of the spray gun is reduced by 60%, reducing ink waste; By optimizing the algorithm of spraying PCB substrate, line angle, and line surface at three key spraying positions, the film thickness is uniform and consistent, reducing the overall ink thickness (compared to previous spraying and screen printing technologies that require thicker substrate positions to meet the requirements of line angle and non line surface), the overall ink usage can be reduced, reaching a level close to that of screen printing ink.

Advantage
- Save ink, close to the amount of screen printing ink used;
- High production efficiency, 6-8 pieces/minute;
- Small holes cannot be blocked;
- The circuit is not prone to redness, and spraying once on boards below 3 ounces can meet the requirements.
Comparison of spraying effects on 3-ounce plates

Spray effect of the third-generation technology for 3-ounce plates


Tested copper thickness of 3oz, independent line height of 106.49 μm, line surface of 23.59 μm, line angle of 13.65 μm, substrate of 49.74 μm

3 oz plate screen printing effect

Compared to the traditional low-pressure spraying+silk screen three stage process, the independent line position is 92.46 μm high, the line surface is 27.9 μm, the line angle is 26.5 μm, and the substrate is 86.08 μm high

Conclusion
With the same copper thickness of 3oz, the third-generation spraying technology saves (86.08-49.74)/86.08=42.22% ink.
Comparison Of Spraying Effects On 1.5-Ounce Plates

Spray effect of the third-generation technology for 1.5-ounce plates


Tested product with 1.5oz bottom copper, independent wire height of 49.1 μm, wire surface of 24.87 μm, wire angle of 18 μm, substrate of 36.98 μm

1.5 oz plate screen printing effect

Compared to the traditional low-pressure spraying+screen printing secondary process, the independent line height of the product is 55 μm, the line surface is 25.06 μm, the line angle is 19.15 μm, and the substrate is 46.16 μm

Conclusion
With the same copper thickness of 1.5oz, the third-generation spraying technology saves (46.16-36.98)/46.16=19.88% ink.
Comparison of spraying effects on 1-ounce plates

Spray effect of the third-generation technology for 1-ounce plates



Tested product has a copper thickness of 1oz, an independent line height of 45 μm, a substrate of 25.67 μm, and a large copper surface of 25.19 μm

1 oz plate screen printing effect

Compared to traditional low-pressure spraying/screen printing processes, the product has a 1oz copper thickness, an independent line height of 47.86 μm, a line surface of 10.08 μm, a line angle of 8.48 μm, and a substrate of 42.24 μm

Conclusion
If the thickness of the oil hanging on the surface and corners of the circuit board with the same copper thickness is the same, the third-generation spraying technology only has a substrate oil thickness of 25.67 μm, which saves (42.24-25.67)/42.24=39.22% ink compared to traditional low-pressure spraying technology.
Benefit calculation
1. Conservatively calculated at 15% fuel efficiency (compared to the second generation spray coating technology).
2. Calculated at approximately 350kg of ink per day.
3. Daily ink savings: 350kg * 0.15=52.5kg, calculated at 55 yuan per kilogram, approximately 52.5 * 55=2887.5 yuan. Monthly savings of 288.75 * 28 days=80850 yuan, annual savings of 80850 * 12 months=970200 yuan.
4. Save 15% of solvent per day, about 21kg. If activated carbon treatment is used to save 84kg of cost, the cost of activated carbon plus material cost is about 7 yuan/kg. Save 84kg * 7 yuan/kg=588 yuan per day, 588 * 28 days per month=16464, and 16464 * 12 months per year=197568 yuan.
In total, annual cost savings of 970200+197568=1168000 yuan
02
Spraying single machine

Advantages:
Small footprint, suitable for small batches and multiple varieties
Project
Model
External dimensions
Maximum spray plate size
Minimum spray size
Spray plate thickness
Workbench
Number of spray guns
Production of copper thickness
Anti blocking rate
Ink quality
Ink uniformity
Takt Time
Spray reciprocating speed
Maximum reciprocating acceleration
Installed power
Ventilation requirements
Table Height
Equipment parameters
PCB-D1
L2700×W2180×H2200mm
L730*W630mm
L300*W300mm
T0.3~4.0mm
Dual worktable, spray painted on one side, upper and lower parts on the other side, 180 ° interaction
2-4 pieces
<3 oz spraying completed once
Finished product aperture ≥ 0.25mm without clogging
Line surface ≥ 10 μ m, line angle ≥ 5 μ m
≥90%
1~2pcs/min
1.5~2.4m/s adjustable
30m/s2
AC380, Three phase five wire system 50Hz, 5kW
4000m ³/H, residual pressure 800Pa
900mm
03
Second Generation: High Viscosity Spraying Line
Working Principle
By using two sets of viscosity ink, one set of high viscosity and one set of low viscosity, two different sets of spray guns are used. The high viscosity gun does not have a low viscosity air spray gun. The high viscosity gun requires greater pressure and spray volume, and requires multiple stacking of high-speed mechanical arms to achieve uniform film thickness. The high viscosity gun is used to first lay the bottom, and then the low viscosity gun cover surface is used to improve surface quality.

Advantage
- Higher production efficiency, 6-8 pieces/minute;
- Small holes cannot be blocked;
- The circuit is not prone to redness, and spraying once on boards below 3 ounces can meet the requirements.
Shortcoming
- Higher cost than the first generation;
- Low ink utilization rate, basically wasting twice as much ink as screen printing, and high usage cost;
- The workload of cleaning and maintenance is high.
04
First generation: Horizontal low-pressure spraying line
Working Principle
Use a low-pressure air atomization gun to atomize ink into small particles, and blow the ink particles towards the surface of the PCB through low-pressure air

Advantage
- High efficiency, 4-6 tablets per minute;
- Small holes cannot be blocked;
- Cost reduction of 80% compared to electrostatic spraying.
Shortcoming
- The ink utilization rate is low, basically wasting twice as much ink as screen printing, and the usage cost is high;
- Large workload of cleaning and maintenance;
- For thick copper plates with a thickness of 1.5 ounces or more, the circuit is prone to redness and generally requires secondary spraying.
Parameter comparison
Comparison project
Model
External dimensions
Maximum spray plate size
Minimum spray size
Spray plate thickness
Production of copper thickness
Anti blocking rate
Ink quality
Ink uniformity
Ink utilization rate
Spray reciprocating speed
Maximum reciprocating acceleration
Over spray distance
Line conveying speed
Installed power
Ventilation requirements
Line conveying height
Third generation provincial ink high-speed spraying line
PCB-X3
L8800*W1950*H2565mm
L730*W630mm
L300*W300mm
T0.8~6.0mm, Not deformed
<3oz spray completed once
Finished hole diameter>0.25mm without blockage
Line surface>15um, line angle>10um
≥90%
61%
1.5~2.4m/S
50m/s2
30mm
2.0-4.5m/min adjustable
AC380V, Three phase five wire system 50Hz, 6kW
7500m '/H, residual pressure 800Pa
1100+50mm
Second generation high viscosity spraying line
PCB-X2
L8800*W1950*H2565mm
L730*W630mm
L300*W300mm
T0.8~6.0mm, Not deformed
Spray once at less than 3oz, add printing once
Finished hole diameter>0.25mm without blockage
Line surface>10um, line angle>5um
≥90%
53%
1.5~2.4m/S
50m/s2
30mm
2.0-4.5m/min adjustable
AC380V, Three phase five wire system 50Hz, 6kW
7500m3/H, residual pressure 800Pa
1100+50mm
First generation horizontal low-pressure spraying line
PCB-X1
L8300*W1800*H2200mm
L730*W630mm
L300*W300mm
T0.8~6.0mm, Not deformed
<2oz spray completed once
Finished product aperture ≥ 0.25mm without blockage
Line surface>10um, line angle>5um
>90%
48%
1.0~1.5m/s
5m/s2
80mm
2.0-3.0m/min adjustable
AC380V three-phase five wire system 50Hz, 5kW
7500m3/H, residual pressure 800Pa
1100+50mm
Video Display



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